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Dimensions:
X mm
Quantity:
Layers:
Thickness:
Aluminium PCB capability

Item

  • Aluminium
  • Thermal conductivity
  • Minimum Trace Wide
  • Minimum Line Space
  • Profile
  • V-cut
  • Surface Finish
  • Surface Finish
  • Hole
  • Maximum finished size
  • FFinal board thickness
  • Tolerance of board thickness
  • Copper Thickness
  • Warp and Twist
  • Thermal conductivity
  • 0.5oz
  • 1oz copper
  • 0.5oz copper
  • 1oz copper
  • Punching Profile tolerance
  • Routing Profile tolerance
  • Tolerance of Conductors & Outline
  • Material Thickness
  • V-cut angle
  • Tolerance of Remain Thickness
  • V-cut Dimension tolerance
  • Groove Width
  • Groove to Groove
  • Groove to Trace
  • Lead free HASL thickness
  • Au thickness of Immersion Au
  • Ni thickness of Immersion Au
  • Solder mask registration tolerance
  • Solder mask Thickness
  • solder mask line width
  • Line to solder PAD
  • solder PAD to solder PAD
  • Minimum drilled hole size
  • Minimum punched hole size
  • Drilling hole diameter Tolerance
  • Hole position tolerance(first)
  • Hole position tolerance(second)
  • hole edge to hole edge
  • hole edge to circuit

(Production Capability)

  • 500mm×400mm
  • 0.8-2.0mm
  • +/-10%
  • 1oz
  • ≤0.75%
  • 1.5, 2.0
  • 0.2mm
  • 0.2mm
  • 0.2mm
  • 0.2mm
  • ±0.13mm
  • ±0.1mm
  • ±0.15mm
  • ≥0.9mm
  • 30±5°
  • ±0.1mm
  • ±0.13mm
  • ≤0.5mm
  • ≥20mm
  • ≥0.45mm
  • 1-40μm
  • 1-5u”
  • 80-200u”
  • ±0.05mm
  • ≥10μm
  • ≥0.1mm
  • 0.1mm
  • 0.2mm
  • 0.8mm
  • 1.2mm
  • ±0.075mm
  • ±0.08mm
  • ±0.13mm
  • ≥0.15mm
  • ≥0.2mm